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TSMC June revenue jumps 67.9% before quarterly results

The Taiwanese foundry posted NT$442.68 billion in June sales as AI-related chip demand continued to support growth.

Sarah Jenkins

By Sarah Jenkins · Chief Macro Economics Correspondent

· 2 min read

TSMC June revenue jumps 67.9% before quarterly results
Photo: CNBC

Taiwan Semiconductor Manufacturing Co. said Monday that June revenue rose 67.9% from a year earlier to NT$442.68 billion, or about $13.8 billion, ahead of its second-quarter earnings later this week. The figure was 6.2% higher than in May, and the company’s shares traded 1% higher on Monday, according to CNBC.

For the first six months of 2026, TSMC reported revenue of NT$2.40448 trillion, equivalent to $74.99 billion, up 35.6% from the same period in 2025. The numbers reinforce the scale of demand flowing through the semiconductor supply chain as artificial intelligence infrastructure spending remains a central driver for advanced chips.

TSMC is the largest company in the contract chipmaking business, according to CNBC. In a pure-foundry model, customers design semiconductors and outsource production to a manufacturer such as TSMC, which fabricates chips for applications ranging from smartphones to high-performance computing systems.

The company’s customer base includes major U.S. technology groups such as Nvidia, Apple and Advanced Micro Devices, CNBC reported. Demand for AI processors and related infrastructure investment has helped lift TSMC’s growth, according to CNBC.

Foundry scale and capacity

Counterpoint Research data showed TSMC held 73% of the global pure-foundry market in the first quarter of 2026. That market refers to chips manufactured for clients, a position that places TSMC at the center of production plans for companies that sell processors but do not make all of them internally.

Reuters reported that TSMC plans to add two advanced chip packaging plants at the Chiayi Science Park in southern Taiwan, citing remarks from Taiwan’s National Science and Technology Council Minister Wu Cheng-wen on Sunday. Wu said the first facility at the site was already in mass production and that the second was expected to begin soon, Reuters reported.

Advanced packaging has become a closely watched part of semiconductor capacity because it sits after wafer fabrication and supports the integration of chips used in complex computing systems. The planned Chiayi additions, as described by Reuters, point to further investment in the manufacturing steps needed to serve high-end chip demand.

TSMC is scheduled to release second-quarter earnings on Thursday, July 16, according to CNBC. Investors will be watching whether the monthly revenue momentum carries into quarterly profit metrics and management commentary on customer demand, capacity expansion and AI-linked orders.

The company’s latest monthly figures add to a broader debate across technology markets over the durability of AI-related capital spending. For now, TSMC’s reported first-half revenue growth shows that the world’s largest contract chipmaker continued to convert customer demand into higher sales through June.

This story draws on original reporting from CNBC.

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